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Role Of Intermetallic Compound On Thermal Crack Propagation Of Lead Free Solders

Wan Muhammad Faiz, Wan Mohamed Arshad (2015) Role Of Intermetallic Compound On Thermal Crack Propagation Of Lead Free Solders. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Abstract

The tendency of development in electronic components is influenced by performance enhancement and the reliability of the soldering. The replacement of conventional tin lead (SnPb) solder to lead free solder have changed the reliability of the component. Alloying constituents have been developed for lead free solder materials to achieve almost as close a reliability level as using conventional solders. However, the issue of reliability is on the failure mechanisms in lead free solder interconnection. This study focused on the microstructural analysis and characterization of the intermetallic compounds growth in the lead free solder with different types of surface finish. The solder material used is SAC 305 which composed of tin, silver and copper. The surface finishes included in this research were bare copper, immersion tin, and electroless nickel immersion gold. The aim was to investigate the intermetallic compound growth in different types of surface finish after 900, 1200 and 1500 cycles of thermal cycling test is applied at 100ºC of cyclic temperature in which affecting the solder joint reliability. After thermal cycling test, the sample were cross sectioned, grinded and polished. Then, the morphology of the sample was reveal under Scanning Electron Microscopy to analyze the formation of intermetallic compounds. The measure shown that immersion tin surface finish produced the highest thickness of intermetallic compounds growth up to 11μm. However, intermetallic compound in copper surface finish shows the lower thickness about 4.5μm. Besides, this research show voiding phenomena happened in the samples of different surface finish and its mechanism is analyzed.

Item Type: Monograph (Project Report)
Uncontrolled Keywords: Intermetallic compounds -- Thermal properties, Intermetallic compounds -- Mechanical properties -- Testing
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Library > Projek Sarjana Muda > FTK
Depositing User: Ahmad Tarmizi Abdul Hadi
Date Deposited: 26 Apr 2016 03:56
Last Modified: 26 Apr 2016 03:56
URI: http://eprints.utem.edu.my/id/eprint/16371

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