Yeo, Kian Hong (2016) Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface. Masters thesis, Universiti Teknikal Malaysia Melaka.
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Effect of epoxy nozzle separation on die attach adhesion at chip substrate interface.pdf - Submitted Version Download (2MB) |
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Abstract
Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to eliminate defects related to the die attach process. Epoxy glue void formation at the chip/substrate interface happens when multi nozzle shower is used for the glue distribution as an adhesive layer. The epoxy unable to flow uniformly, thus air is trapped in the epoxy layer at the chip/substrate interface. The current study investigates the effect of the shower head nozzles' separation (wall space) on the epoxy void formation and die shear strength. It was found that the nozzle separation has a significant and positive correlation on the void formation, but not on the shear strength of the die attach chip/substrate interface. Thus, it is recommended that the nozzles' separation (wall space) dimension to be increased by reducing quantity of nozzle used in order to reduce the void percentage to be equal or less than five percent.
| Item Type: | Thesis (Masters) |
|---|---|
| Uncontrolled Keywords: | Nozzles, Semiconductors |
| Subjects: | T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Library > Tesis > FKP |
| Depositing User: | Mohd. Nazir Taib |
| Date Deposited: | 10 Jul 2018 08:03 |
| Last Modified: | 16 Dec 2022 16:53 |
| URI: | http://eprints.utem.edu.my/id/eprint/21028 |
| Statistic Details: | View Download Statistic |
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