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Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface

Chua, Kok Yau and A.R.M., Warikh and T., Joseph Sahaya Anand (2012) Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15-16 October 2012, Hotel Equatorial, Melaka.

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Abstract

Cu-Al intermetallic compound (IMC) in Cu wire-Al bond pad bonding interface has been an area of interest for researchers. In this paper, characterization of IMC at bonding interface of annealed diode micro-chip has been performed using Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray (EDX) as well as less commonly used X-ray Diffraction (XRD). Combination of these techniques offers overall picture of the micro-structure and crystallography of the IMC at the bonding interface. SEM imaging and line scan EDX reveal the interdiffusion zone of Cu-Al. TEM imaging with EDX line scan and phase diagram deduce the phase of IMC present at the interdiffusion zones. Slow XRD scan of powder sample detects only the CuAl phase in the sample which implies that this phase is dominant in the sample.

Item Type: Conference or Workshop Item (Speech)
Uncontrolled Keywords: Thermosonic bonding, Cu wire, intermetallic compound, XRD.
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Manufacturing Engineering > Department of Engineering Materials
Depositing User: Dr. T. Joseph Sahaya Anand
Date Deposited: 26 Mar 2013 04:35
Last Modified: 28 May 2015 03:46
URI: http://eprints.utem.edu.my/id/eprint/6959

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