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| Title: |
Heat transfer in an array of
staggered tube using CFD method |
| Authors: |
Shamsul, Bahari
Mohd Yusoff,
Sulaiman
Abd Talib, Din
Adib, Muizzudin |
| Keywords: |
Heat exchangers
Fluid
dynamics
Computational Fluids Dynamic (CFD)
Tube banks
Heat
exchangers -- Design and construction
Heat -- Transmission --
Mathematical models
Tubes -- Fluid dynamics |
| Issue Date: |
11-Oct-2009 |
| Publisher: |
Universiti Malaysia Perlis |
| Citation: |
p.1A 1 - 1A 10 |
| Series/Report no.: |
Proceeding of International
Conference on Applications and Design in Mechanical Engineering
2009 (iCADME 2009) |
| Abstract: |
Heat exchangers are found in numerous
industrial applications such as steam generation in aboller or
cooling in the coll of an air conditioner. Heat tranfer in flow
across tube bank is importance in designing of heat exchanger. there
are two types of arrangement of tube banks, such as in-kine and
staggered maner and are characterized by the dimensionless
transverse and longitudinal pitches. CFD simulation codes ANSYS CFX
software is used to investigated the heat flow across an array of
staggered tuibe at three different aspect pitch ratios. The working
fluids used are air and water. The flow and beat transfer
characteristic of a staggered tube a nearly the same of a single
cylinde/tube. The first row characteristic is usually the same as a
single tube. But for the second row and so on, the cherectieristic
are depend on the rows that's come first. for a single tube actually
there are two boundry layers which occur at front of the tube and
the back of the tube. laminar boundry layer alwas developed at the
front while turbulent at the back. Several geometry. The other
parameters such as the flud velocity and temperature are also
defined accoding to the previous research. With these parameters th
3-D simulation has been done using CFX software. The results
obtained are in terms of velocity, temperature and pressure profile.
From the investigation, the lower value of potch ratio is found to
give better heat tranfer rate. When the pitch value is decreased,
the pressure drop will rise and thus will increace the heat transfer
rate. |
| Description: |
Organized by School of Mechatronic
Engineering (UniMAP) & co-organized by The Institution of
Engineering Malaysia (IEM), 11th - 13th October 2009 at Batu
Feringhi, Penang, Malaysia. |
| URI: |
http://hdl.handle.net/123456789/7172 |
| ISSN: |
978-967-5415-07-4 |
| Appears in Collections: |
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