Items where Author is "Cheong, MT"
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Article
Suresh, Kumar and Sivarao, Subramonian and Cheong, MT and Fuaida, Harun (2010) Solving Eventual Bonding Quality to Enhance Adhesion For QFN Packages. 34th International Electronic Manufacturing Technology Conference, 2010. pp. 1-6. ISSN 1089-8190