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Micro hole drilling by industrial CO2 laser

Mohd Kamal , Mohd Kasim (2014) Micro hole drilling by industrial CO2 laser. Project Report. UTeM, Melaka, Malaysia. (Submitted)

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Laser machining is one of the most popular advance machining in this world. Nowadays, laser micromachining is currently used in the MEMS production to take over the traditional method such as etching process that needs a period of time to finish the process. The objective of this study is to investigate the drilling capability of industrial laser, CO2 laser, in silicon wafer processing. In this work, the holes were drilled on P-type silicon wafer with thickness 525 μm and 100 mm diameter. The holes were observed by using an optical microscope. Geometrical characteristic of holes produce, which is diameter entrance that depends on laser parameter were investigated and analyzed. Response Surface Methodology (RSM) was used to analyze the result and generated an appropriate model for the laser drilling processing. The laser parameters involve were laser power, pulse frequency and duty cycle. The experiment result showed the entrance diameter of drilling holes increased when the laser power and duty cycle increased, but the entrance diameter decreased as the pulse frequency decreased.

Item Type: Monograph (Project Report)
Uncontrolled Keywords: Laser beam cutting, Silicon -- Surfaces -- Analysis
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Library > Projek Sarjana Muda > FKP
Depositing User: Norziyana Hanipah
Date Deposited: 30 Oct 2015 08:25
Last Modified: 30 Oct 2015 08:25

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