Thermal Analysis of Staggered Pin Fin Heat Sink for Central Processing Unit

Mohd Annuar, Khalil Azha and Mohd Ab Halim, Mohd Firdaus and Ismail, Fatimah Sham and Madiha , Zahari and Siti Halma, Johari and Harun, Mohamad Haniff (2015) Thermal Analysis of Staggered Pin Fin Heat Sink for Central Processing Unit. Australian Journal of Basic and Applied Sciences. pp. 68-73. ISSN 1991-8178

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The advancement of microelectronics technology in producing high clock speed and power density’s central processor unit (CPU) indirectly related to thermal management issue. This is a major challenge to the manufacturers, designers and researchers to find the optimum design of the cooling system. If the problem is not being tackled, it will become a major setback to the development of electronic components and devices in the next five to ten years. The most popular technique used in the electronic devices is a metal heat sink with high heat transfer rate. The choice and suitable for the optimal heat sink design are needed in order to control and increase the heat dissipation. In this paper, 3D simulation staggered pin fin heat sink is designed and analyzed using COMSOL Multiphysics software. The finding of this study then is used to propose an optimal staggered pin fin arrangement of heat sink design that could give better thermal performance.

Item Type: Article
Uncontrolled Keywords: Heat sink, Thermal, Heat Transfer
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Engineering Technology
Depositing User: Mohamad Haniff Harun
Date Deposited: 21 Sep 2016 02:45
Last Modified: 09 Sep 2021 22:32
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