Effect of yeast content as pores forming agent on porous alumina ceramic

Selamat, Mohd Zulkefli and Salleh, Suhaila and Lau, Kok Tee and Jumaidin, Ridhwan and Nasir, Nurulfazielah (2022) Effect of yeast content as pores forming agent on porous alumina ceramic. International Journal of Nanoelectronics and Materials, 15 (1). pp. 18-26. ISSN 1985-5761

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Abstract

This research is carry out to determine the effect of yeast content on the physical, mechanical and macrostructure properties of porous alumina ceramic material. The porous ceramic material was fabricated through the mixing of alumina, calcium oxide and zeolite as the main materials. Meanwhile, the ethylene glycol as the binder. Besides that, yeast used as a pores forming agent and the value is varied from 0 wt.% up to 20 wt.% from the total weight of ceramic materials. After that, the slurry was cast into mold and allowed it to dry underthe room temperature before being sintered at the temperature of 1400 °C for two hours. Linear shrinkage, apparent porosity, macrostructural analysis, pores size measurement and mechanical tests were carry out to determine the effect of yeast content on the porous ceramic. The results showed that the linear shrinkage, average apparent porosity and pore size increased with the increased weight percentage of yeast content from 1.63% to 6.66%, 35.46% to 46.54% and 49.814 µm to 194.297 µm, respectively. The increasing of porosity and pore size give an effect to the mechanical strength of sintered porous ceramic by decreasing it from 17.47 MPa to 10.66 MPa, which were inversely proportional to porosity and pore size. Thus shown that yeast as pores forming agent have huge potential in fabrication of porous ceramic material products

Item Type: Article
Uncontrolled Keywords: Porous ceramic material, Yeast, Pores forming agent, pore and porosity
Divisions: Faculty of Mechanical Engineering
Depositing User: Norfaradilla Idayu Ab. Ghafar
Date Deposited: 06 Mar 2023 12:26
Last Modified: 06 Mar 2023 12:26
URI: http://eprints.utem.edu.my/id/eprint/26303
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