Stress analysis on hybrid nanoparticle GNP/Ag for flexible semiconductor packaging devices

Salim, Mohd Azli and Mohammad Noor, Norida and Masripan, Nor Azmmi and Photong, Chonlatee and Chew, Kit Wayne and Watson, Alan (2025) Stress analysis on hybrid nanoparticle GNP/Ag for flexible semiconductor packaging devices. Journal of Advanced Research in Micro and Nano Engineering, 30 (1). pp. 22-32. ISSN 2756-8210

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Abstract

his research investigates the stress analysis of hybrid nanoparticle GNP/Ag conductive inks under various curing conditions, specifically varying time and temperature settings. The study addresses the challenges of reliably quantifying the adhesive strength of printed conductive inks for flexible semiconductor packaging devices, aiming to ensure the reliability and long-term sustainability of printed electronics under various environmental conditions. To formulate the GNP hybrid conductive ink, GNP powder was mixed with ethanol and sonicated. Subsequently, Ag and SA were added to the GNP/ethanol mixture, followed by sonication for one hour with each addition. The resulting GNP/Ag/SA mixture was heated on a hotplate and stir using a magnetic stirrer until the ethanol evaporated and then cured in a furnace for one hour. The mixture was then ground into a fine powder and combined with 1-butanol and terpineol to form a paste. This paste was printed in overlapping layers on two copper substrates and cured at 240°C, 250°C, and 260°C for 4, 5, and 6 hours respectively. Testing was conducted in accordance with ASTM D1002 Standard Test Method to determine the shear strength of adhesives using the lap shear test. The findings indicated that increased curing temperatures and duration negatively impact the shear strength of the conductive ink, highlighting the correlation between curing conditions and adhesion properties. Future research should focus on integrating additives or modifying the ink composition to enhance adhesion qualities during high-temperature curing.

Item Type:	Article
Uncontrolled Keywords:	Graphene nanoplatelet (GNP), Silver flakes (Ag), Hybrid conductive ink, Adhesion, Curing, Temperature, Lap shear test
Divisions:	Faculty Of Mechanical Technology And Engineering
Depositing User:	Norfaradilla Idayu Ab. Ghafar
Date Deposited:	17 Jul 2026 03:53
Last Modified:	17 Jul 2026 03:53
URI:	http://eprints.utem.edu.my/id/eprint/29977
Statistic Details:	View Download Statistic

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