Salim, Mohd Azli and Masripan, Nor Azmmi and Mansor, Muhd Ridzuan and Zainordin, Ahmad Zaifazlin and Photong, Chonlatee and Watson, Alan (2026) Evaluating mechanical and conductivity of graphene-silver hybrid inks on copper substrate at elevated temperature. IIUM Engineering Journal, Special Issue in Mechanical Engineering, 27 (1). pp. 194-213. ISSN 1511-788X
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Abstract
This study investigates the effect of temperature on the damping behaviour, stiffness, and natural frequency of hybrid conductive ink (HCI) printed on a copper (Cu) substrate. The HCI comprises graphene nanoplatelets (GNPs), silver flakes (SF), and silver acetate (SA). The objective is to evaluate the HCI’s electrical conductivity and mechanical properties under varying thermal conditions. The HCI paste was formulated with a specified ratio of organic solvents, terpineol, and 1-butanol and cured in an oven at 260°C for 3 hours. The baseline droplet ratio was set at 1:1, and three Cu samples with varied HCl compositions were printed using a 60 µm mesh stencil process. The terpineol concentrations were changed while the 1-butanol droplet remained constant. The samples were then tested for electrical conductivity at room temperature using a two-point probe, in accordance with IEEE Std 118- 1978, followed by mechanical behaviour testing using an ASTM E756-05 impact test. Furthermore, the samples were exposed to a range of temperature tests to evaluate mechanical and electrical conductivity under thermal stress. The results showed that the baseline composition exhibited minimal resistance and resistivity across the temperature range, with an average resistance of ≤ 0.2 Ω and a resistivity of ≤ 0.8 Ω · mm, respectively. The baseline composition also exhibited reduced stiffness and damping, with natural frequencies of 10.90, 1.40 kN/m, and 37.51 Hz across the samples. Therefore, the baseline composition exhibits relatively good electrical and mechanical properties for applications in flexible electronics.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Hybrid conductive ink, Graphene, Resistivity, Damping, Stiffness, Frequency |
| Divisions: | Faculty Of Mechanical Technology And Engineering |
| Depositing User: | Norfaradilla Idayu Ab. Ghafar |
| Date Deposited: | 04 Sep 2026 01:06 |
| Last Modified: | 04 Sep 2026 01:06 |
| URI: | http://eprints.utem.edu.my/id/eprint/30372 |
| Statistic Details: | View Download Statistic |
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