Items where Author is "Abdullah, Mohd Zulkifly"

Article

Ali Mokhtar, Mohd Najib and Abdullah, Mohd Zulkifly and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2018) Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Journal of Telecommunication, Electronic and Computer Engineering (JTEC) . pp. 1-7. ISSN 2180-1843 (In Press)

Abdullah, Mohd Zulkifly and Ali Mokhtar, Mohd Najib and Saad, Abdullah Aziz and Samsudin, Zambri and Che Ani, Fakhrozi (2017) Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering. Microelectronics Reliability, 79. pp. 69-78. ISSN 0026-2714