Items where Author is "Abdullah, Mohd Zulkifly"

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Article

Ali Mokhtar, Mohd Najib and Abdullah, Mohd Zulkifly and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Z. (2018) Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Journal of Telecommunication, Electronic and Computer Engineering (JTEC) . p. 1. ISSN 2180-1843

Ali Mokhtar, Mohd Najib and Abdullah, Mohd Zulkifly and Saad, Abdullah Aziz and Samsudin, Zambri and Che Ani, Fakhrozi (2017) Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering. Microelectronics Reliability, 79. pp. 69-78. ISSN 0026-2714

This list was generated on Sat Sep 26 06:06:28 2020 +08.