Items where Author is "Goh, Soon Lock"
 | Up a level |
Group by: Item Type | No Grouping
Jump to: Conference or Workshop Item
Number of items: 1.
Conference or Workshop Item
Tai, Min Fee and Lee, Swee Kah and Goh, Soon Lock and Kok, Swee Leong and Kenichiroh, Mukai and Tafadwa, Magaya (2014) Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance. In: IEEE International Conference on Semiconductor Electronics (ICSE), , 27-29 Aug. 2014, Kuala Lumpur.