Items where Author is "Hoo, K.I."
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Conference or Workshop Item
Palagud, Jose and Lim, T.S. and Jasmee, Solehah and Masdzarif, Nur Diana Izzani and Wang, S.W. and Hoo, K.I. and Omar, Ghazali (2023) Analysis on bonding wires of Au-Coated Ag alloy for IBGA automotive application. In: 25th Electronics Packaging Technology Conference, EPTC 2023, 5 December 2023through 8 December 2023, Singapore.