Items where Author is "Kok, Hoi Ern"
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Article
Kok, Hoi Ern and Lau, Kok Tee (2021) DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels. Journal of Mechanical Engineering, 18 (3). pp. 131-145. ISSN 1823- 5514
Lau, Kok Tee and Kok, Hoi Ern and Ab Maulod, Hairul Effendy and Abdul Latiff, Nurizzatul Zahirah and Abdul Aziz, Aida Nazifa and Rosli, Nur Hazirah (2019) Effect Of Laminating Press’s Opening-Stacking Position On Adhesive Thickness In Coverlay/Adhesive/Flexible-Printed-Circuit Sheet. Journal Of Engineering Technology And Applied Physics, 1 (1). pp. 1-3. ISSN 2682-8383