Items where Author is "Lee, Swee Kah"
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Conference or Workshop Item
Tai, Min Fee and Lee, Swee Kah and Goh, Soon Lock and Kok, Swee Leong and Kenichiroh, Mukai and Tafadwa, Magaya (2014) Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance. In: IEEE International Conference on Semiconductor Electronics (ICSE), , 27-29 Aug. 2014, Kuala Lumpur.