Items where Author is "Liew, David"
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Mohd Noh, Mohd Syahrin Amri and Liew, David and Harun, Fuaida (2010) Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process. Chipping Free Process For Combination Of Narrow Saw Street (60UM) And Thick Wafer (600UM) Sawing Process, 1 (1). pp. 1-5. ISSN 1089-8190
Mohd Noh, Mohd Syahrin Amri and Liew, David and Harun, Fuaida (2010) Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process. In: 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), Nov. 30 2010-Dec. 2 2010 , Melaka. (Submitted)