Items where Author is "Lim, Weng Keat"

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Article

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Yeow, See Leong and Lim, Weng Keat and Hng, May Ting (2013) Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads. Current Applied Physics, 13 (8). pp. 1674-1683. ISSN 1567-1739

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