Items where Author is "Ong, C. G."
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Lau, Kok Tee and Munawar, Rose Farahiyan and Arif@Harip, Afraha Baiti and Ong, C. G. (2020) Effect Of Contact Pad’s Roughness And Ni–P Plating Thickness On Leadless Packages’ Shear Strength Variation. Transactions on Electrical and Electronic Materials, 21. pp. 1-9. ISSN 1229-7607