Items where Author is "Wong, Kah Yan"
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Article
Liew, Pay Jun and Wong, Kah Yan and Lau, Kok Tee and Jingsi, Wang (2020) Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology. Journal of Advanced Manufacturing Technology (JAMT), 14 (2). pp. 1-14. ISSN 1985-3157
Thesis
Wong, Kah Yan (2021) Surfaces (Technology) Surface preparation Coating processes Tungsten carbide-cobalt alloys. Masters thesis, Universiti Teknikal Malaysia Melaka.