Items where Author is "Yan, Jiwang"

Liew, Pay Jun and Yap, Ching Yee and Othman, Intan Sharhida and Abdollah, Mohd Fadzli and Yan, Jiwang (2021) Tribological Characteristics Of Electrical Discharge Coated Layers Using Quarry Dust Suspension. Surface and Coatings Technology, 428. pp. 1-9. ISSN 0257-8972

Liew, Pay Jun and Yap, Ching Yee and Wang, Jingsi and Zhou, Tianfeng and Yan, Jiwang (2020) Surface Modification And Functionalization By Electrical Discharge Coating: A Comprehensive Review. International Journal of Extreme Manufacturing, 2 (1). pp. 1-32. ISSN 2631-8644

Liew, Pay Jun and Shaaroni, Ainusyafiqah and Che Sidik, Nor Azwadi and Yan, Jiwang (2017) An Overview Of Current Status Of Cutting Fluids And Cooling Techniques Of Turning Hard Steel. International Journal of Heat and Mass Transfer, 114 (-). pp. 380-394. ISSN 0017-9310

Liew , Pay Jun and Yan , Jiwang and Kuriyagawa, Tsunemoto (2014) Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM. International Journal of Machine Tools & Manufacture. pp. 13-20. ISSN 0890-6955

Liew , Pay Jun and Yan , Jiwang and Kuriyagawa, Tsunemoto (2013) Experimental investigation on material migration phenomena in micro-EDM of reaction-bonded silicon carbide. Applied Surface Science. pp. 731-743. ISSN 0169-4332

Liew , Pay Jun and Yan , Jiwang and Kuriyagawa, Tsunemoto (2013) Carbon nanofiber assisted micro electro discharge machining of reaction-bonded silicon carbide. Journal of Materials Processing Technology. pp. 1076-1087. ISSN 0924-0136

Liew , Pay Jun and Shimada, Keita and Mizutani, Masayoshi and Yan , Jiwang and Kuriyagawa, Tsunemoto (2013) Fabrication of Microstructures on RB-SiC by Ultrasonic Cavitation Assisted Micro-Electrical Discharge Machining. International Journal of Automation Technology. pp. 621-629. ISSN 881-7629

Liew, Pay Jun and Yan , Jiwang and Masaki, Takeshi and Kuriyagawa, Tsunemoto (2012) Effect of Different Dielectric Fluids on Micro EDM of Low Conductivity Ceramic Material RB-SiC. Advanced Materials Research. pp. 529-534. ISSN 10226680