Thermal performance of various pin fin heat sink design for electronic cooling

Khalil Azha , Mohd Annuar (2014) Thermal performance of various pin fin heat sink design for electronic cooling. Masters thesis, Universiti Teknologi Malaysia.

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Abstract

Central Processing Unit (CPU) has high capability and powerful in processing data at the higher speed. With increasingly the functionality, design complexity and the compactness of the CPU’s system, thermal problem becomes an important issue. This problem has significantly reduced the performance and lifetime of the components. Thus, to control and minimize the temperature of this electronic package especially for the laptop, notebook and et cetera, the conventional external heat sink has been used widely. Various type of heat sink with different shapes, dimensions and materials have been designed in order to improve the heat transfer process and at the same time to maintain the CPU’s performance. This project presents 3D simulation heat sink design by using COMSOL multiphysics software package. The simulation was carried out for various arrangements of pin fins heat sinks such as inline, staggered and optimum position. The simulation results have proposed a new arrangement of pin fin that able to give 2.3% and 0.2% better thermal performance compared to the conventional design, which is inline and staggered arrangement.

Item Type: Thesis (Masters)
Uncontrolled Keywords: thermal analysis, heat sink (electronics)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Library > Tesis > FTK
Depositing User: Khalil Azha Mohd Annuar
Date Deposited: 28 Jan 2015 03:10
Last Modified: 28 May 2015 04:20
URI: http://eprints.utem.edu.my/id/eprint/11798
Statistic Details: View Download Statistic

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