Items where Author is "Kok, Chee Kuang"

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Kok, Chee Kuang and J.W.C. Chin and M.M. Rajmohan and V.S.H. Yeo and Said, Md Radzai (2012) Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method. Journal of Electronic Materials, 41 (4). pp. 774-781. ISSN 0361-5235

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