Microstructural Analysis of Intermetallic Ni5Al3 Thin Films

T., Joseph Sahaya Anand (2010) Microstructural Analysis of Intermetallic Ni5Al3 Thin Films. Journal of Mechanical Engineering and Technology, 2 (1). pp. 25-39. ISSN 2180-1053

This is the latest version of this item.

[img] PDF (JMET 2(1), 2010 , 25-39.)
JMET_2010.pdf
Download (2MB)

Abstract

The possible magnetic transition phenomenon obtained is postulated particularly on the Nickel Aluminum (Ni5Al3) thin films of different thickness. It was found that the film resistance exhibits a linear but mild increase over the initial temperature range, followed by a transition to a relatively rapid decline in the resistance after attaining maximum at ~170ºC. This positive temperature coefficient of resistance (TCR) makes this material suitable for magneto resistor applications. The same observations were made on two different sputtering systems with different deposition conditions, indicating that the magnetic transition is a highly reproducible phenomenon.

Item Type: Article
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Faculty of Manufacturing Engineering > Department of Engineering Materials
Depositing User: Dr. T. Joseph Sahaya Anand
Date Deposited: 21 Nov 2013 03:37
Last Modified: 28 May 2015 04:09
URI: http://eprints.utem.edu.my/id/eprint/10148
Statistic Details: View Download Statistic

Available Versions of this Item

Actions (login required)

View Item View Item