Contaminants on Electrical Contacts Used in Semiconductor Device Testing

SAID, MD RADZAI and Tan, CheeFai (2013) Contaminants on Electrical Contacts Used in Semiconductor Device Testing. World Applied Sciences Journal. pp. 1352-1354. ISSN 1818-4952

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Abstract

Electrical contacts used in semiconductor device testing are often deposited with a small pip of dark colour contaminants after being subjected to repeating cycles of impact loading. Samples of used electrical contacts are checked under SEM and EDX. It is discovered that the contaminants contain high percentage of tin elements. The reason as to why the contamination formed is investigated and it is found to be the result of material transfer from device lead. It is caused by the molten metal bridge formed when the contact begins to move apart.

Item Type:	Article
Subjects:	T Technology > TJ Mechanical engineering and machinery
Divisions:	Faculty of Mechanical Engineering > Department of Design and Innovation
Depositing User:	Ir. Dr. CheeFai Tan
Date Deposited:	27 Jan 2014 06:53
Last Modified:	28 May 2015 04:12
URI:	http://eprints.utem.edu.my/id/eprint/10662
Statistic Details:	View Download Statistic

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