Mohd Annuar, Khalil Azha and Ismail, Fatimah Sham and Harun, Mohamad Haniff and Mohd Ab Halim, Mohd Firdaus (2015) Inline pin fin heat sink model and thermal performance analysis for central processing unit. In: Proceedings of Mechanical Engineering Research Day 2015, 3 Mac 2015, Universiti Teknikal Malaysia Melaka.
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Abstract
The thermal management issue hermal management issue is common in electronic products such as computers, projectors and others, The trend shows that by increasing the power density, indirectly it will increase the temperature anf power dissipation in CPU processor. This is a major challenge to the product designer of electronics cooling system to find an alternative technique to solve this problem. Therefore, in order to control and minimize the heat produced by the CPU's processor, the conventional external heat cik is added to the overall thermal management mechanism. In this paper, 3D simulation inline pin fin heat sink is designed using COMSOL Multiphysics software. The outcome of this study hopefully can shed some light on how to optimize inline pin fin arrangement heat sink design.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Faculty of Engineering Technology |
| Depositing User: | Mohamad Haniff Harun |
| Date Deposited: | 01 Nov 2016 02:58 |
| Last Modified: | 01 Nov 2016 02:58 |
| URI: | http://eprints.utem.edu.my/id/eprint/17503 |
| Statistic Details: | View Download Statistic |
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