Ali Mokhtar, Mohd Najib and Abdullah, Mohd Zulkifly and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2018) Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Journal of Telecommunication, Electronic and Computer Engineering (JTEC) . pp. 1-7. ISSN 2180-1843 (In Press)
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2018 JTEC Paper 2_Najib_FKP.pdf Download (915kB) |
Abstract
Reliability of surface mount components and interconnect are significant issues in electronic manufacturing. Although the reliability of devices has been broadly studied,here we are focusing on the reliability of the solder joint after the self-alignment phenomena during reflow soldering.In this study,the quality of the self-alignment assemblies was analyzed relate to the joint shear strength according to the JIS Z3 198-7 standard and the inspection according to IPC-A-610E standard.The results from reliability study indicate that the shear strength of the misalignment component of solder joints indeed depends on the degree of chip component misalignment.For shift mode configuration in the range of 0-300µm,the resulted chip assembly inspection after the reflow process was in line with the IPC-A-610E standard.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Lead-free solder, Reliability, Shear stress, Solder joint |
| Divisions: | Faculty of Manufacturing Engineering > Department of Robotics and Automation |
| Depositing User: | Mohd. Nazir Taib |
| Date Deposited: | 15 May 2019 03:05 |
| Last Modified: | 05 Jul 2021 10:16 |
| URI: | http://eprints.utem.edu.my/id/eprint/21356 |
| Statistic Details: | View Download Statistic |
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