Ab Majid, Nurul Kausar and Ismail, Fatimah Sham (2019) Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method. Telkomnika (Telecommunication Computing Electronics and Control), 17 (5). pp. 2268-2275. ISSN 2302-9293 (In Press)
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Abstract
The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic system. This project presents the simulation of an optimal thermal distribution for various samples of electronics components arrangement on PCB. The objectives are to find the optimum components arrangement with minimal heat dissipation and cover small PCB area. Nelder-Mead Optimization (NMO) with Finite Element method has been used to solve these multi-objective problems. The results show that with the proper arrangement of electronics components, the area of PCB has been reduced by 26% while the temperature of components is able to reduce up to 40%. Therefore, this study significantly benefits for the case of thermal management and performance improvement onto the electronic product and system.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Finite element method, Nelder-Mead method, Optimization, Thermal distribution |
| Divisions: | Faculty of Electrical Engineering |
| Depositing User: | Sabariah Ismail |
| Date Deposited: | 04 Aug 2020 12:45 |
| Last Modified: | 04 Aug 2020 12:45 |
| URI: | http://eprints.utem.edu.my/id/eprint/24279 |
| Statistic Details: | View Download Statistic |
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