Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

Omar, Ghazali and Esa, Siti Rahmah and Sheikh Md Fadzullah, Siti Hajar and Siow, Kim Shyong and Abdul Rahim, Bazura and Cosut, Bunyemin (2020) Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology. International Journal of Nanoelectronics and Materials, 13 (SI). 461 - 472. ISSN 1985-5761

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Abstract

Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. This material typically consists of metallic particles bounded by polymer binder expected to diffuse at the temperature much lower than its melting temperature. This paper studies the diffusion mechanism between Ag particles and its microstructural change over different heat treatment temperature that leads to the understanding on the formation of bonding particles into a predominantly solid Ag network as a conducting path for the interconnect systems. The surface diffusion initiated between Ag particles as they come into intimate contact through the formation of necking. Further atomic movement and diffusion between the particles neck resulting in volume expansion, necking growth as well as the transformation of the particle shape from spherical into an elongated structure. This results in the formation of a long chain of connecting particles, which transform the Ag particles into a solid Ag network.

Item Type:	Article
Uncontrolled Keywords:	Diffusion, Grain size, Mechanism, Microstructure, Sintered Ag
Divisions:	Faculty of Mechanical Engineering
Depositing User:	Sabariah Ismail
Date Deposited:	04 Mar 2021 15:15
Last Modified:	31 May 2023 15:22
URI:	http://eprints.utem.edu.my/id/eprint/24862
Statistic Details:	View Download Statistic

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