Accelerating Image Processing Of Wafer Inspection

Md Salim, Sani Irwan and Lim, Kim Chuan and Mohd Yusof, Zulkalnain and Choo, Chin Yoon (2020) Accelerating Image Processing Of Wafer Inspection. [Technical Report] (Submitted)

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Abstract

Wafer inspection, where quality electronics integrated circuit is ensured to be manufactured, is playing an important role at the front line of E&E based manufacturing. The current line scan camera-based image processing software for wafer inspection, (edge detection, morphological operations, and thresholding) is not able to run fast enough to meet the requirement for 8” wafer processing. In this project, an industry-grade PC is utilized with the available computing resources to parallelized and accelerate the required image processing pipeline for wafer inspection. The image processing recipes, which are provided by Synergy Integrated Resources Sdn Bhd, has successfully implemented through image processing acceleration technique. With the high signal to noise ratio image (produced by the precision micro stage) and quality line scan camera connected to the frame grabber, the captured wafer image has been increased up to 500 wafer chip inspection per second or 30,000 wafer chip per minutes. The identified wafer chip is processed in the constructed image processing pipeline defined with OpenVX and subsequently accelerated by Intel OpenVINO to fully utilize the Central Processing Unit (CPU) cores, Graphics Processing Unit (GPU), and Image Processing Unit (IPU), simultaneously. The performance of the image processing pipeline has also been increased significantly. This achievement offers a solution to the speed deficiency problems that bogged the current line scan camera-based image processing software for 8” wafer inspection.

Item Type: Technical Report
Uncontrolled Keywords: Image processing, Wafer Inspection
Divisions: Library > Technical Report > FKEKK
Depositing User: F Haslinda Harun
Date Deposited: 03 Jan 2022 14:50
Last Modified: 03 Jan 2022 14:50
URI: http://eprints.utem.edu.my/id/eprint/25460
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