Bonding Material Enhancement For Surface Mount Component On Plastic Assembly

Sheikh Md. Fadzullah, Siti Hajar and Omar, Ghazali and Mustafa, Zaleha and Hasan, Rafidah and Mohd Noh, Mohd Syahrin Amri and Wu, Jonathan and Samsudin, Zambri (2019) Bonding Material Enhancement For Surface Mount Component On Plastic Assembly. [Technical Report] (Submitted)

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Abstract

This project is about formulating and characterizing the electrically conductive adhesive (ECA) as eco-friendly, lead-free interconnect materials. This project aims to identify an optimum formulation of the ECA when using epoxy as a matrix with multiwalled carbon nanotube (MWCNT) as the conductive filler (with two different length), in the range of 5 to 12 wt.%. and also its optimum composition to enhance join strength while not compromising its main functional property, that is as electrically conductive adhesive.

Item Type: Technical Report
Uncontrolled Keywords: Electric conductivity, Adhesives , Adhesion, Electrically conductive adhesive, ECA
Divisions: Library > Technical Report > FKM
Depositing User: F Haslinda Harun
Date Deposited: 22 Mar 2022 09:45
Last Modified: 22 Mar 2022 09:45
URI: http://eprints.utem.edu.my/id/eprint/25482
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