The evolutions of microstructure in pressureless sintered silver die attach material

Omar, Ghazali and Esa, Siti Rahmah and Sheikh Md Fadzullah, Siti Hajar and Siow, Kim Shyong and Abdul Rahim, Bazura (2021) The evolutions of microstructure in pressureless sintered silver die attach material. International Journal of Nanoelectronics and Materials, 14 (2). pp. 179-194. ISSN 1985-5761

Text IJNEAM2021015_THE EVOLUTION OF MICROSTRUCTURE IN PRESSURELESS SINTERED SILVER DIE ATTACH MATERIALS.PDF Download (920kB)

Abstract

Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric adhesive binder at 200 °C, 250 °C, 275 °C, and 300 °C for a duration of 2 hours. The grains, particles, and neck growth observed via two-dimensional Focused Ion Beam (FIB) cuts on the samples at different sintering temperatures were associated with the atomic motions and reduction of surface energy that is the driving force for sintering. In this study, the pressureless sintering process in a polymeric adhesive binder successfully transformed the scattered Ag particles into a compact and dense Ag joining at 300 °C. The electrical conductivity value obtained at 300 °C was 5.2E+05 S/cm, which was the highest among the evaluation samples.

Item Type:	Article
Uncontrolled Keywords:	Grain Size, Microstructure, Neck Growth, Porosity, Sintered Ag
Divisions:	Faculty of Mechanical Engineering
Depositing User:	Norfaradilla Idayu Ab. Ghafar
Date Deposited:	05 May 2022 11:07
Last Modified:	20 Jul 2023 15:43
URI:	http://eprints.utem.edu.my/id/eprint/25742
Statistic Details:	View Download Statistic

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