Transient thermal simulation analysis of die-attach adhesives

Salim, Mohd Azli and Ab Wahid, Ameeruz Kamal and Masripan, Nor Azmmi and Photong, Chonlatee and Md. Saad, Adzni and Akop, Mohd Zaid (2022) Transient thermal simulation analysis of die-attach adhesives. International Journal of Nanoelectronics and Materials, 15 (SI). pp. 505-522. ISSN 1985-5761

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Abstract

This paper discusses the approach of using a three-dimensional finite element analysis (FEA) model for transient thermal analysis of die-attach materials layers with the silicon carbide (SiC) diodes directly attached to the bonded copper. For FEA analysis, six different die-attach materials models were developed: Au/Sn (80/20) braze, nanoscale silver, SAC alloy solder paste, Epo-Tek P1011 epoxy, graphene, and copper. By evaluating the maximum temperature and total heat flux, FEA modeling can be utilized to identify which die-attach materials have more effect on the thermal conductivity of the model. Fourier’s law of heat conduction was implemented to investigate transient thermal characteristics during heating with commercial software code, namely ANSYS. Temperature dependency and thermal material properties, and other thermal parameters boundary conditions were taken into consideration throughout the thermal conductivity procedure. The temperature and total heat flux distribution changes of the die-attach and substrate assemblies were obtained and transient thermal characteristics were analyzed during heating within 1.5 s by using temperature load, 90.3 °C on the dies (diode) surface. Moreover, heat flow was also measured in the model by comparing the thermal resistance discovered in the die-attach materials with a manual calculation. The graphene achieved the best results in terms of the least maximum temperature and total heat flux values, 90.3 °C and 11.04 x 106 W/m2 respectively. As a result, graphene-based die-attach materials produce an efficient heat conductor, which can become beneficial in the future. This is due to the lowest thermal resistance and highest thermal conductivity of graphene die-attach materials.

Item Type:	Article
Uncontrolled Keywords:	Die-attach materials, Finite element analysis, Transient thermal, Thermal resistance, Total heat flux
Divisions:	Faculty of Mechanical Engineering
Depositing User:	mr eiisaa ahyead
Date Deposited:	24 Mar 2023 11:18
Last Modified:	24 Mar 2023 11:18
URI:	http://eprints.utem.edu.my/id/eprint/26667
Statistic Details:	View Download Statistic

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