Modelling of surface roughness for glass-assisted co2 laser machined p-type silicon wafer

Sivarao, Subramonian and Prasath, K.P. and Ramesh, S. and Kadirgama, Kumaran and Pujari, S. and Vatesh, Umesh Kumar and Salleh, Mohd Shukor and Ali, Mohd Amran and Maidin, Shajahan (2023) Modelling of surface roughness for glass-assisted co2 laser machined p-type silicon wafer. In: 8th Brunei International Conference on Engineering and Technology 2021, BICET 2021, 8 November 2021 through 10 November 2021, Bandar Seri Begawan.

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Abstract

Carbon Dioxide (CO2) Laser Machining has been in high demand as compared to other high-end conventional machining processes as it is capable of producing super precision cutting with a non-contact technology. The objective of this research is to establish mathematical model to predict laser cut surface roughness of the P-type silicon wafer processed with assistive Pyrex glass. The design parameters employed in this fractional factorial design of experiment were laser power, cutting speed, and pulse frequency. P-type silicon wafers were machined using assistive Pyrex glass to observe if it gives significant effect on the cut quality. Commercially available statistical package namely Response Surface Methodology (RSM) was used to optimise the design parameters and establish the predictive model. The findings reveal that, Pyrex glass assisted laser machining has significant contribution in the laser processing of P-type silicon wafer.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Experiment design, Glass, Machining, Mathematical modeling, Laser materials processing, Solid state lasers, Chemical elements
Divisions: Faculty Of Industrial And Manufacturing Technology And Engineering
Depositing User: Anis Suraya Nordin
Date Deposited: 20 Sep 2024 16:06
Last Modified: 20 Sep 2024 16:06
URI: http://eprints.utem.edu.my/id/eprint/27894
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