Wafer dicing vibration investigation on novel wafer mounting techniques

Mohd Noh, Mohd Syahrin Amri and Omar, Ghazali and Mispan, Mohd Syafiq and Harun, Fuaida and Othman, Md Nazri and Ngatiman, Nor Azazi and Mat Ibrahim, Masrullizam (2024) Wafer dicing vibration investigation on novel wafer mounting techniques. IEEE Transactions on Semiconductor Manufacturing, 37 (4). pp. 583-590. ISSN 0894-6507

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Abstract

Chipping has emerged as a significant issue in semiconductor manufacturing, particularly during the dicing process. The existing conventional single-sided wafer mounting technique does not have sufficient holding capability which contributes to instability during dicing and causes higher chipping performance. The objective of the study is to develop a novel wafer mounting technique that can hold the wafer firmly during dicing and improve the chipping performance. In the experiment, chipping and vibration performance during the dicing process on novel double-sided semi and full-sandwich wafer mounting were investigated and compared with the conventional singlesided wafer mounting technique. Chipping was measured using high power scope and ImageJ software while the vibration was initiated using the NI 9234 Sound-Vibration Module and SDT1-028K Piezoelectric film. Implementing extended surface tape coverage on double-sided UV mounting tape for the full sandwich wafer mounting technique resulted in superior wafer gripping during dicing and produced the lowest topside and backside wafer chipping performance. The novel double-sided full sandwich wafer mounting technique has demonstrated higher wafer holding capability, resulting in lower vibration during dicing and improved overall chipping performance.

Item Type:	Article
Uncontrolled Keywords:	Chipping, Crack, Sandwich wafer mounting, Vibration, Wafer dicing.
Divisions:	Faculty Of Mechanical Technology And Engineering
Depositing User:	Norfaradilla Idayu Ab. Ghafar
Date Deposited:	05 Feb 2025 15:59
Last Modified:	05 Feb 2025 15:59
URI:	http://eprints.utem.edu.my/id/eprint/28378
Statistic Details:	View Download Statistic

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