Sivakumar, Dhar Malingam (2004) APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY. In: 3rd INTERNATIONAL CONFERENCE ON ADVANCED MANUFACTURING TECHNOLOGY (ICAMT 2004), 11-13 May 2004, Kuala Lumpur, Malaysia.
![[img]](http://eprints.utem.edu.my/style/images/fileicons/application_pdf.png) |
PDF
TPM-ICAMT_2004.pdf Restricted to Registered users only Download (356kB) | Request a copy |
Abstract
Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pad (NSOP), which was the top yield lost contributor. Floating die contributed 48% of the NSOP defect. How Focus Improvement activity is used to reduce Non Stick on Pad due to floating die is shown. As a result NSOP due to floating die had been reduced from 1300 parts per million (ppm) to 650 ppm a reduction of 50% within one year.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Faculty of Mechanical Engineering > Department of Structure and Materials |
| Depositing User: | Dr Sivakumar Dhar Malingam |
| Date Deposited: | 17 Jul 2012 07:00 |
| Last Modified: | 28 May 2015 02:41 |
| URI: | http://eprints.utem.edu.my/id/eprint/4312 |
| Statistic Details: | View Download Statistic |
Actions (login required)
 |
View Item |