Application of Total Productive Maintenance to Reduce Non-Stick on Pad Problem in IC Packaging

Sivakumar, Dhar Malingam (2012) Application of Total Productive Maintenance to Reduce Non-Stick on Pad Problem in IC Packaging. International Journal of Engineering and Science, 3 (1). pp. 14-32. ISSN 2086-3799

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Focus improvement activity was employed to improve front-end assembly yield in integrated circuit packaging. The top three yield losses in parts per million (ppm) in front-end assembly were contributed by the following defects: non-stick on pad (NSOP) (2715 ppm), chip and crack (782 ppm) and missing wire (687 ppm). NSOP was due to floating die, bonded ball small in size, foreign matter on pad and glassifications. Floating die contributed 48% of the NSOP defect. Detailed explanation on how focus improvement activity used to reduce NSOP due to floating die is demonstrated. Upon identifying the root cause of die floating, which was due to no support and weakness in the vacuum system, actions were taken to eliminate and to control the identified causes. As a result NSOP due to floating die was reduced from 1300 ppm to 650 ppm, a reduction of 50% within one year.

Item Type: Article
Uncontrolled Keywords: Focus improvement, overall equipment effectiveness, total productive maintenance, yield improvement
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Mechanical Engineering > Department of Structure and Materials
Depositing User: Dr Sivakumar Dhar Malingam
Date Deposited: 06 Jan 2013 01:29
Last Modified: 26 Jan 2022 13:08
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