XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip

Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip. In: International Conference on X-Rays & Related Techniques in Research & Industry , 3-5 July 2012, Vistana Hotel, Penang.

Text Anand_UTeM_XRD_analysis.pdf Restricted to Registered users only Download (41kB) | Request a copy

Abstract

Cu-Al intermetallic compound (IMC) in Cu wire-Al bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction (XRD) technique to identify the IMC phase in the crashed Cu wired micro-chip samples. CuAl phase is identified from measurement with lower scanning rate. KOH treatment for enhancing IMC peaks intensity does not work as expected as it etches the IMC as well.

Item Type:	Conference or Workshop Item (Speech)
Uncontrolled Keywords:	Intermetallic compound, X-ray diffraction, Micro-chip, Wire-bonding
Subjects:	T Technology > TJ Mechanical engineering and machinery
Divisions:	Faculty of Manufacturing Engineering > Department of Engineering Materials
Depositing User:	Dr. T. Joseph Sahaya Anand
Date Deposited:	26 Mar 2013 04:07
Last Modified:	25 May 2023 11:02
URI:	http://eprints.utem.edu.my/id/eprint/6958
Statistic Details:	View Download Statistic

Actions (login required)

View Item