A. P., Puvanasvaran (2012) A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15 - 16 October 2012, Melaka.
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Abstract
Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive literature review from previous study. The strength on different interconnection materials of wire (gold and aluminum) and bond pad (copper and aluminum) after temperature cycle is investigated by using DMAIC methodology. The study is started with the reliability test with various Temperature Cycle (TC) stress and Failure Analysis testing was carried out to collect the wire pull strength value and ball shear strength value of different device.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | Wire pull, Ball shear, Temperature Cycle (TC), DMAIC methodology |
| Subjects: | H Social Sciences > HD Industries. Land use. Labor > HD28 Management. Industrial Management |
| Divisions: | Faculty of Manufacturing Engineering > Department of Manufacturing Management |
| Depositing User: | Prof. Madya Ir. Dr. Puvanasvaran A.Perumal |
| Date Deposited: | 02 Apr 2013 02:10 |
| Last Modified: | 28 May 2015 03:46 |
| URI: | http://eprints.utem.edu.my/id/eprint/7055 |
| Statistic Details: | View Download Statistic |
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