Items where Author is "Che Ani, Fakhrozi"

Omar, Ghazali and A Hamid, Husna and Azli, Siti Ashikin and Jasmee, Solehah and Jalar, Azman and Tamaldin, Noreffendy and Che Ani, Fakhrozi (2020) Thermo-Mechanical And Adhesion Performance Of Silver-Filled Conductive Polymer Composite (SFCP) Using Thermoplastic Polyurethane (TPU) Substrate. International Journal of Nanoelectronics and Materials, 13 (SI). pp. 419-430. ISSN 1985-5761

Ali Mokhtar, Mohd Najib and Mohammed Zulkifly, Abdullah and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2019) Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering. Journal Of Advanced Manufacturing Technology (JAMT), 13 (2). pp. 45-56. ISSN 1985-3157

Jasmee, Solehah and Omar, Ghazali and Masripan, Nor Azmmi and Kamarolzaman, Anita Akmar and A S Ashikin and Che Ani, Fakhrozi (2018) Hydrophobicity Performance Of Polyethylene Terephthalate (PET) And Thermoplastic Polyurethane (TPU) With Thermal Effect. Materials Research Express, 5 (9). pp. 1-12. ISSN 2053-1591

Ali Mokhtar, Mohd Najib and Abdullah, Mohd Zulkifly and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2018) Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Journal of Telecommunication, Electronic and Computer Engineering (JTEC) . pp. 1-7. ISSN 2180-1843 (In Press)

Abdullah, Mohd Zulkifly and Ali Mokhtar, Mohd Najib and Saad, Abdullah Aziz and Samsudin, Zambri and Che Ani, Fakhrozi (2017) Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering. Microelectronics Reliability, 79. pp. 69-78. ISSN 0026-2714