Items where Author is "Cheong MT"
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Article
Suresh, Kumar and Subramonian, Sivarao and Cheong MT and Mohd Azmeer and Harun, Fuaida (2010) Solving eventual bonding quality to enhance adhesion for QFN packages. 34th International Electronic Manufacturing Technology Conference, 2010. pp. 1-6. ISSN 1089-8190