Items where Author is "Harun, Fuaida"

Article

Mohd Noh, Mohd Syahrin Amri and Liew, David and Harun, Fuaida (2010) Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process. Chipping Free Process For Combination Of Narrow Saw Street (60UM) And Thick Wafer (600UM) Sawing Process, 1 (1). pp. 1-5. ISSN 1089-8190

Suresh, Kumar and Sivarao, Subramonian and Guan, Tan Kim and Harun, Fuaida (2010) Influence of Wafer Probing Against Initial Bonding. 34th International Electronic Manufacturing Technology Conference, 2010. pp. 1-8. ISSN 1089-8190

Suresh, Kumar and Subramonian, Sivarao and Cheong MT and Mohd Azmeer and Harun, Fuaida (2010) Solving eventual bonding quality to enhance adhesion for QFN packages. 34th International Electronic Manufacturing Technology Conference, 2010. pp. 1-6. ISSN 1089-8190

Conference or Workshop Item

Mohd Noh, Mohd Syahrin Amri and Liew, David and Harun, Fuaida (2010) Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process. In: 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), Nov. 30 2010-Dec. 2 2010 , Melaka. (Submitted)