Items where Author is "Lee, Cher Chia"
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Article
Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and Thangaraj, Joseph Sahaya Anand (2013) XRD Analysis Of Cu-Al Interconnect Intermetallic Compound In An Annealed Micro-Chip. Advanced Materials Research, 620. pp. 166-172. ISSN 10226680
Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia and Thangaraj, Joseph Sahaya Anand (2003) XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip. Advanced Materials Research, 620. pp. 166-172. ISSN 1022-6680
Conference or Workshop Item
Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Abd Rashid, Mohd Warikh and Hng, May Ting and Lee, Cher Chia (2012) Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15-16 October 2012, Hotel Equatorial, Melaka.
Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) X-ray Diffraction Study of Intermetallic Cu-Al Interconnection in Electronic Components. In: International Conference of Young Researchers on Advanced Materials, July 1 - 6, 2012, MATRIX Building< National University of Singapore (NUS), Singapore. (Unpublished)
Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip. In: International Conference on X-Rays & Related Techniques in Research & Industry , 3-5 July 2012, Vistana Hotel, Penang.
Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Hng, May Ting and Lee, Cher Chia (2012) Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip. In: International Conference on X-Rays & Related Techniques in Research & Industry 2012 (ICXRI 2012) , 3-5 Julai 2012, Vistana Hotel, Pulau Pinang.
Thesis
Lee, Cher Chia (2017) Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. Masters thesis, Universiti Teknikal Malaysia Melaka.