Items where Author is "Lim, Boon Huat"
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Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Lim, Boon Huat (2012) Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip. Materials Chemistry and Physics, 136 (2-3). pp. 638-647. ISSN 0254-0584