Items where Author is "Lim, Boon Huat"
 | Up a level |
Group by: Item Type | No Grouping
Jump to: Article
Number of items: 1.
Article
Thangaraj, Joseph Sahaya Anand and Chua, Kok Yau and Lim, Boon Huat (2012) Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip. Materials Chemistry and Physics, 136 (2-3). pp. 638-647. ISSN 0254-0584