Items where Author is "Saad, Abdullah Aziz"

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Ali Mokhtar, Mohd Najib and Mohammed Zulkifly, Abdullah and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2019) Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering. Journal Of Advanced Manufacturing Technology (JAMT), 13 (2). pp. 45-56. ISSN 1985-3157

Ali Mokhtar, Mohd Najib and Abdullah, Mohd Zulkifly and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2018) Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Journal of Telecommunication, Electronic and Computer Engineering (JTEC) . pp. 1-7. ISSN 2180-1843 (In Press)

Abdullah, Mohd Zulkifly and Ali Mokhtar, Mohd Najib and Saad, Abdullah Aziz and Samsudin, Zambri and Che Ani, Fakhrozi (2017) Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering. Microelectronics Reliability, 79. pp. 69-78. ISSN 0026-2714

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