Items where Author is "Samsudin, Zambri"

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Number of items: 5.


Ali Mokhtar, Mohd Najib and Mohammed Zulkifly, Abdullah and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2019) Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering. Journal Of Advanced Manufacturing Technology (JAMT), 13 (2). pp. 45-56. ISSN 1985-3157

Ali Mokhtar, Mohd Najib and Abdullah, Mohd Zulkifly and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2018) Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Journal of Telecommunication, Electronic and Computer Engineering (JTEC) . pp. 1-7. ISSN 2180-1843 (In Press)

Abdullah, Mohd Zulkifly and Ali Mokhtar, Mohd Najib and Saad, Abdullah Aziz and Samsudin, Zambri and Che Ani, Fakhrozi (2017) Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering. Microelectronics Reliability, 79. pp. 69-78. ISSN 0026-2714

Technical Report

Sheikh Md. Fadzullah, Siti Hajar and Omar, Ghazali and Mustafa, Zaleha and Hasan, Rafidah and Mohd Noh, Mohd Syahrin Amri and Wu, Jonathan and Samsudin, Zambri (2019) Bonding Material Enhancement For Surface Mount Component On Plastic Assembly. [Technical Report] (Submitted)

Omar, Ghazali and Samsudin, Zambri and Nordin, Mohd Nur Azmi and Kamarolzaman, Anita Akmar and Masripan, Nor Azmmi and Salim, Mohd Azli and Mansor, Muhd Ridzuan and Wu, Jonathan Wei Ping (2019) An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly. [Technical Report] (Submitted)

This list was generated on Fri Dec 9 18:41:28 2022 +08.