Che Soh, Mohd Norhisham and Bugis, Ismadi and Jamaludin, Irma Wani and Ranom, Rahifa (2011) Thermal analysis on PCB using Galerkin approach. In: 4th International Conference On Modeling, Simulation & Applied Optimization (ICMSAO 2011) , 19-21 April 2011, Impiana KLCC Hotel and Spa, Kuala Lumpur.
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THERMAL ANALYSIS ON PCB USING GALERKIN APPROACH-NORHISHAM CHE SOH-MAK 00623 RAF.pdf Download (3MB) |
Abstract
This paper presents the analysis of temperature rise on PCB. Numerical solutions using Galerkin approach that is one of Finite Element Method (FEM) was used to study and analyze the temperature rise on PCB. Then, an algorithm has been developed using MATLAB. The PCB with four different width of copper is supplied with different range of direct current (DC) from 0.5 to 5 Amperes to capture the data by using FLIR i5 Infrared Thermal Imager. The data then compared with numerical result and obtain an error. In order to minimize the error, an analysis is done based on Galerkin approach with heat transfer film coefficient obtained from the experiment. The numerical results showed good agreement with the experimental results and it can be proved that the algorithm developed based on Galerkin approach can be applied to the thermal analysis on PCB.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | Printed circuits, Materials, Finite element method, Power resources, Thermal analysis |
| Divisions: | Faculty of Electrical Engineering > Department of Mechatronics Engineering |
| Depositing User: | Users 4097 not found. |
| Date Deposited: | 15 Dec 2017 00:34 |
| Last Modified: | 31 Jul 2023 11:55 |
| URI: | http://eprints.utem.edu.my/id/eprint/20173 |
| Statistic Details: | View Download Statistic |
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