Lau, Kok Tee and Kok, Hoi Ern and Ab Maulod, Hairul Effendy and Abdul Latiff, Nurizzatul Zahirah and Abdul Aziz, Aida Nazifa and Rosli, Nur Hazirah (2019) Effect Of Laminating Press’s Opening-Stacking Position On Adhesive Thickness In Coverlay/Adhesive/Flexible-Printed-Circuit Sheet. Journal Of Engineering Technology And Applied Physics, 1 (1). pp. 1-3. ISSN 2682-8383
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Abstract
This study is to investigate the dependence of coverlay’s adhesive thickness on the laminating press’s opening-stacking position. Coverlays using acrylic- and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and 195°C for 150 min. Adhesive thickness measurements show opening-stacking positions near to the bottom of laminating press machine produced more consistent adhesive thickness as compared to the top positions.
Item Type: | Article |
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Uncontrolled Keywords: | Flexible electronics, Adhesive layer, Flexible printed circuit, Adhesive, Copper clad laminate |
Subjects: | T Technology > T Technology (General) T Technology > TJ Mechanical engineering and machinery |
Divisions: | Faculty of Mechanical and Manufacturing Engineering Technology |
Depositing User: | Mohd Hannif Jamaludin |
Date Deposited: | 15 Jun 2020 14:33 |
Last Modified: | 15 Jun 2020 14:33 |
URI: | http://eprints.utem.edu.my/id/eprint/24070 |
Statistic Details: | View Download Statistic |
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