Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering

Ali Mokhtar, Mohd Najib and Mohammed Zulkifly, Abdullah and Saad, Abdullah Aziz and Che Ani, Fakhrozi and Samsudin, Zambri (2019) Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering. Journal Of Advanced Manufacturing Technology (JAMT), 13 (2). pp. 45-56. ISSN 1985-3157

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Abstract

A deep understanding in thermal characteristics of lead-free solder paste grades is one of the most crucial factors when dealing with reflow soldering process. These temperatures are critical parameters for proper settings of the real reflow process. This report is devoted to discussing the findings obtained during utilization of differential scanning calorimetry (DSC) and calculation using MATLAB to identify the latent heat, solidus and liquidus temperature, and surface tension applicable to numerically simulate the real process of reflow soldering. It can be stated that the equilibrium solidus and liquidus temperatures during solidification process are not a reversal of the melting process, with the solid phase equilibrium occurred at a lower temperature due to the difficulty of ß-Sn nucleation. Amount of heat energy released during solidification differs less than 10% for SAC405 and less than 1% for SAC105 with the latent heat of fusion during the melting process.

Item Type:	Article
Uncontrolled Keywords:	DSC, SAC solder, Reflow soldering, Temperature profile, Thermomechanical properties
Divisions:	Faculty of Manufacturing Engineering > Department of Robotics and Automation
Depositing User:	Norfaradilla Idayu Ab. Ghafar
Date Deposited:	08 Dec 2020 15:58
Last Modified:	25 Jun 2021 15:11
URI:	http://eprints.utem.edu.my/id/eprint/24458
Statistic Details:	View Download Statistic

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