Mode stresses for a thermally insulated curve crack in bonded two half planes

Hamzah, Khairum and Nik Long, Nik Mohd Asri and Senu, Norazak and Eshkuvatov, Zainiddin K. (2020) Mode stresses for a thermally insulated curve crack in bonded two half planes. Menemui Matematik (Discovering Mathematics), 42 (1). pp. 34-44. ISSN 2231-7023

Text MODE STRESSES FOR A THERMALLY INSULATED CURVE CRACK IN BONDED TWO HALF PLANES.PDF Download (669kB)

Abstract

Modifified complex potential (MCP) function was applied to formulate the new hypersingular integral equations (HSIEs) for a thermally insulated curve crack in the upper side of bonded two half planes subjected to various mode stresses by the assist from conditions of continuity for the displacement, resultant force and heat conduction functions. This new HSIEs is solve numerically by using curve length coordinate function and quadrature formulas for the unknown crack opening displacement (COD) function and the right hand side is the traction along the crack. The obtained COD function is then used to compute the stress intensity factors (SIF) in order to analyze the stability behavior of the materials containing cracks or flaws. Numerical results presented the behavior of nondimensional SIF at tips subjected to four mode stresses such as Mode I (Normal), Mode II (Shear), Mode III (Tearing) and Mix Mode stresses.

Item Type:	Article
Uncontrolled Keywords:	Thermally insulated crack, Bonded two half planes, Hypersingular integral equation, Stress intensity factor
Divisions:	Faculty of Mechanical and Manufacturing Engineering Technology
Depositing User:	Sabariah Ismail
Date Deposited:	14 Sep 2021 15:12
Last Modified:	20 Jul 2023 16:01
URI:	http://eprints.utem.edu.my/id/eprint/25295
Statistic Details:	View Download Statistic

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